The incumbent serves as a Warfighter Support Division Electronics Technician in support of (but not limited to) the following client funded programs: Technical Data Packages, Quick Reaction Engineering (QRE), and Legacy Systems Sustainment.

Work involves reverse engineering, rapid prototyping, technology insertion, and the support of advanced microelectronics technologies in fielded weapon systems and new developments. Incumbent also supports back-end manufacturing PCB packaging/assembly, environmental tests, inspection and screening processes for the printed circuit board assembly (PCBA) tools, automated solder paste screen printing, surface mount (SMT) Pick & Place and reflow soldering for mix technologies (i.e.,Pb and Pb-Free solder, lead and lead-free respectively), PCBA rework/repair, product environmental testing for military and space applications, counterfeit inspections, and PCBA Inspections. Incumbent is responsible for assembly, disassembly, and repair of miniature circuit card assemblies with ultra-fine pitch components, such as 36-pin uBGA with 0.4mm pitch between pins, Wafer Chip Scale Package(WCSP), Fine Pitch Ball Grid Array (FBGA), Quad Flat No-leads (QFN), and Land Grid Array (LGA) packages, with and without ground plane, 01005 Discrete Elements, and other challenging components, assembly, disassembly, and repair of through-hole components onto a printed circuit board (PCB) using hand tools, interfacing with engineering team to build unique and custom cable assemblies, troubleshooting electronics assemblies using electronic bench equipment, such as multi-meters and oscilloscopes, and more advanced tools, such as X-Ray, and assembly of next higher assembly systems, involving multiple circuit cards, enclosures, and epoxies to meet mechanical requirements.(90%)