Summary description:

The incumbent serves as a Warfighter Support Division Electronics Technician in support of (but not limited to) the following client funded programs: Technical Data Packages, Quick Reaction Engineering (QRE), and Legacy Systems Sustainment.

Job description:

Work involves reverse engineering, rapid prototyping, technology insertion, and the support of advanced microelectronics technologies in fielded weapon systems and new developments. Incumbent also supports back-end manufacturing PCB packaging/assembly, environmental tests, inspection and screening processes for the printed circuit board assembly (PCBA) tools, automated solder paste screen printing, surface mount (SMT) Pick & Place and reflow soldering for mix technologies (i.e.,Pb and Pb-Free solder, lead and lead-free respectively), PCBA rework/repair, product environmental testing for military and space applications, counterfeit inspections, and PCBA Inspections. Incumbent is responsible for assembly, disassembly, and repair of miniature circuit card assemblies with ultra-fine pitch components, such as 36-pin uBGA with 0.4mm pitch between pins, Wafer Chip Scale Package(WCSP), Fine Pitch Ball Grid Array (FBGA), Quad Flat No-leads (QFN), and Land Grid Array (LGA) packages, with and without ground plane, 01005 Discrete Elements, and other challenging components, assembly, disassembly, and repair of through-hole components onto a printed circuit board (PCB) using hand tools, interfacing with engineering team to build unique and custom cable assemblies, troubleshooting electronics assemblies using electronic bench equipment, such as multi-meters and oscilloscopes, and more advanced tools, such as X-Ray, and assembly of next higher assembly systems, involving multiple circuit cards, enclosures, and epoxies to meet mechanical requirements.(90%)

Eligibility factors: